Description
Machine designed and customized for specific wafer or FPC
Software developed & tailor-made to suit end-user requirements
2DBC generated by and uploaded to the server
User-friendly interface for easy operation, authority-level operator, technician & engineer
High precision alignment & marking, +/-30μm,
High repeatability with CPK>1.33
Laser-safety with door-lock, ionizer to remove static,
Fully automation with high UPH ( 3-4K for Flex, 6K-8K for Wafer PCBA)
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