AUTOMATIC LASER ETCHING MACHINE FOR WAFER-OVERVIEW
- Creative
- Customizable
- Adaptive
Product Description
- Automatic multi-station mode, double-side grooving at the same time, ultra-fast laser processing, to achieve high efficiency and income generation;
- Compatible with different sizes of silicon chip;
- Efficiently automatic alignment, customized operation interface and functions;
- High precision visual positioning and detection design effectively ensure the machining accuracy and test results;
- No pollution, zero consumables and environmental friendly.
VIDEO
ADVANTAGES
- Automatic loading/unloading from cassette;
- Vision system equipped for positioning process;
- Machine includes robot for product transportation. Two lasers, two work station and vision system enable precisely scribing on both face synchronously at high speed.
SPECIFICATIONS
Wavelength | Power | Wafer Size | Single Side Accuracy | Position Deviation for Both Sides | Beam Width | Z axis Travel | Power Supply | Air | Dimension |
355nm | 5W/10W | 4 inch, 5 inch, 6 inch | ±10μm | <20μm | >15μm | 100mm | AC 220V, 50Hz | 0.5MPa | 1300 × 1200 × 1800mm |
SOLUTIONS
Application Effects
Laser is applied to etch wafer surface with single side accuracy of 10μm, position deviation of 20μm for both sides.
